DD200 ESD Moisture Barrier Bag is laminated by combining polyester film, aluminum foil, nylon film and low density polyethylene film, and finished up with surface antistatic processing. After being vacuumed, the DD200 is more resistant to damage by external force, it effectively isolates static electricity and moisture, and provides full protection for your products.
This product is applicable to semiconductor, electronic chip, optic components, LCD, and all electronic components that are sensitive to static electricity and moisture.
Specifications:
Electrical Properties:
Typical Values
Test Procedures/ Method
Surface Resistivity:
Outer Surface
≦1011ohms/sq
EOS/ESD-S11.11-2001
Metallic Layer
100 ohms/sq
EOS/ESD-S11.11-2001
Inner Surface
≦1011 ohms/sq
EOS/ESD-S11.11-2001
Charge Decay
Less than 0.03 second
FTMS-101C Method 4046.1
Physical Properties :
Typical Values
Test Procedures/ Method
Bag Thickness:
Polyester Layer
23 Mic
ASTM D-2103
AL Layer
6 Mic
ASTM D-2103
Nylon Layer
15 Mic
ASTM D-2103
Polyethylene Layer
150 Mic
ASTM D-2103
Total Thickness
200 Mic
ASTM D-2103
Puncture Strength
17.2 kgf
FTMS 101C Method 2065.1
Water Vapor transmission
≤ 0.03 g/m2.day
ASTM E96
Heat-seal strength
11.3 kgf/15mm
CNS 10591
Heat Sealing Conditions
Temperature
108 ℃~220℃
Time
0.5~3.5 seconds
Pressure
30~70 PSI
Item
CAS NO.
Test Method
Test Results
Detected Limit
Unit
Fluorine(F)
007782-41-4
Analysis was performed by IC
N.D.
50
ppm(mg/kg)
Potassium(K+)
024203-36-9
Analysis was performed by IC
N.D.
0.001
ug/cm2
Ammonium(NH4+)
014798-03-9
Analysis was performed by IC
0.002
0.001
ug/cm2
Phosphate(Po43-)
---
Analysis was performed by IC
0.002
0.001
ug/cm2
Chromiun(Cr)
007440-47-3
Analysis was performed by ICP-MS
N.D.
0.001
ug/cm2
We provide customized laminating material for a variety of product requirements (minimum ordering quantity required). If the latest test data are needed, please contact our sales. We will provide the latest inventory and product specification that matches your needs.