TYVEK® is a series of non-woven fiber products registered and manufactured by DuPont.
This material is strong and durable. Its strength stronger than that of paper, and more versatile than woven materials. This spunbonded olefin is made using high density polyethylene (>99%). Tyvek has a wide variety of application by having a balanced physical property that combines the advantages of paper, film and fiber.
TYVEK® is made from high-density polyethylene fibers (one tenth the width of a human hair), formed by a continuous process of very fine 0.5-10 micrometer fibers. These nondirectional fibers (plexifilaments) are first spun and then bonded together by heat and pressure, without the use of binders and fillers. Tyvek® is strong, lightweight, soft and smooth, does not fray fibers and particles, antistatic, opaque, water resistant, chemical resistant, scratch resistant and chemically stable. The unique combination of these properties makes Tyvek® ideal for a broad range of applications in the electronics industry including semiconductor wafer separator, LCD, LED, and hi-tech dust-free product packaging.
Property
TYVEK® 1025D
TYVEK® 1057D
TYVEK® 1073D
Test Method
Basis weight(g/m²)
42.5
55.0
75.0
DIN EN ISO 536(2)
Thickness(μ m)
130
160
205
DIN EN 20534(4)
Tensile(N/2.54cm)-MD
94
140
205
DIN EN ISO 1924-2(5)
Tensile(N/2.54cm)-XD
90
145
215
DIN EN ISO 1924-2(5)
Elongation at Break(%)-MD
11-21
14-30
14-21
DIN EN ISO 1924-2(5)
Elongation at Break(%)-XD
15-25
15-30
17-24
DIN EN ISO 1924-2(5)
Tear Elmendorf(N)-MD
6.0
4.8
5.5
DIN EN 21924
Tear Elmendorf(N)-XD
5.7
5.0
5.7
DIN EN 21924
Opacity(%)
96.0
96.0
97.0
ISO2471(7)
Deiamination-MD(N/2.54cm)
1.0
1.6
1.75
ASTM D2724-87(8)
Burt strength(kPa)
550
830
1200
ISO 2758
Surface Resistivity(Ω/Sq)
﹤1012
﹤1012
﹤1012
ASTM D257
Static Decay(S)
﹤0.02
﹤0.02
﹤0.02
FTMS 101C M4046.1
•For long storage, maintain environment conditions at 25 ± 10℃ and 60 ± 15% RH.
The data above are averages. If the the latest test datas are needed, please contact our sales.
