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包裝材料
DD150 抗靜電鋁箔袋
圖片放大
產品編號: DD150
產品簡介:
抗靜電鋁箔袋是由聚脂薄膜、鋁箔膜、尼龍膜及低密度聚乙稀膜貼合後,再做表面抗靜電處理而成,能有效隔離靜電及水氣。
 
此產品適用於:
抽真空用途之產品、半導體晶圓及晶片、光學元件、電腦機板、LCD、及對靜電較敏感的電子元件。

Specifications:

Electrical Properties : Typical Values Test Procedures/
Method
Surface Resistivity(表面阻抗):
Outer Surface(外層表面) ≦1011  ohms/sq EOS/ESD-S11.11-2001
Metallic Layer(金屬層) 100 ohms/sq EOS/ESD-S11.11-2001
Inner Surface(裡層) ≦1011  ohms/sq EOS/ESD-S11.11-2001
Charge Decay(靜電消散) Less than 0.03 second FTMS-101C Method 4046.1
Physical Properties : Typical Values Test Procedures/
Method
Bag Thickness(抗靜電鋁箔袋厚度):    
Polyester Layer(聚脂膜) 12 Mic ASTM D-2103
AL Layer(鋁箔層) 6 Mic ASTM D-2103
Nylon Layer (尼龍膜層) 15 Mic ASTM D-2103
Polyethylene Layer(聚乙稀膜) 110 Mic ASTM D-2103
Total Thickness(總厚度) 150 Mic ASTM D-2103
Tensile Strength-TD(拉力強度-縱向) 449 kgf/cm2 ASTM D882
Tensile Strength-MD(拉力強度-橫向) 545 kgf/cm2 ASTM D882
Puncture Strength(穿刺強度) 12.6 kgf FTMS 101C Method 2065.1
Tear Strength-TD(撕裂強度-縱向) 2.7 kgf ASTM D1004
Tear Strength-MD(撕裂強度-橫向) 2.6 kgf ASTM D1004
Oxygen transmission(透氧度) ≤0.43 cc/m2.day ASTM D3985
Water Vapor transmission(透濕度) ≤0.03 g/m2.day ASTM F1249
Elongation-TD(延伸率-縱向) 59.60 % ASTM D882
Elongation-MD(延伸率-橫向) 66.60 % ASTM D882
Heat Sealing Conditions(熱封條件)    
Temperature(溫度) 108 ℃~220℃  
Time(時間) 0.5~3.5 seconds  
Pressure(壓力) 30~70 PSI  
Seal Strength(封口強度) 10.8kgf/15mm ASTM F88
Item CAS NO. Test Method Test
Results
Detected
Limit
Unit
Fluorine(F) 007782-41-4 Analysis was
performed by IC
N.D. 50 ppm(mg/kg)
Potassium(K+) 024203-36-9 Analysis was
performed by IC
N.D. 0.001 ug/cm2
Ammonium(NH4+) 014798-03-9 Analysis was
performed by IC
0.002 0.001 ug/cm2
Phosphate(Po43-) --- Analysis was
performed by IC
0.002 0.001 ug/cm2
Chromiun(Cr) 007440-47-3 Analysis was
performed by ICP-MS
N.D. 0.001 ug/cm2

如需最新半成品、成品庫存明細、測試資料,或產品規格資料,請洽業務承辦人員。

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