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包裝材料
DD200 抗靜電鋁箔袋
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產品編號: DD200
產品簡介:
抗靜電鋁箔袋是由聚脂薄膜、鋁箔膜、尼龍膜及低密度聚乙稀膜貼合後,再做表面抗靜電處理而成。
DD200抽真空後袋子受外力碰撞較不容易破損,並能有效隔離靜電及水氣,為您的產品做最完善的防護。
此產品適用於:
半導體晶圓、晶片、光學元件、LCD、及對靜電、溼氣較敏感的電子元件。

Specifications:

Electrical Properties: Typical Values Test Procedures/
Method
Surface Resistivity(表面阻抗):
Outer Surface(外層表面) ≦1011  ohms/sq EOS/ESD-S11.11-2001
Metallic Layer(金屬層) 100 ohms/sq EOS/ESD-S11.11-2001
Inner Surface(裡層) ≦1011 ohms/sq EOS/ESD-S11.11-2001
Charge Decay(靜電消散) Less than 0.03 second FTMS-101C Method 4046.1
Physical Properties : Typical Values Test Procedures/
Method
Bag Thickness(抗靜電鋁箔袋厚度):    
Polyester Layer(聚脂膜) 23 Mic ASTM D-2103
AL Layer(鋁箔層) 6 Mic ASTM D-2103
Nylon Layer (尼龍膜層) 15 Mic ASTM D-2103
Polyethylene Layer(聚乙稀膜) 150 Mic ASTM D-2103 
Total Thickness(總厚度) 200 Mic ASTM D-2103
Puncture Strength(穿刺強度) 17.2 kgf FTMS 101C Method 2065.1
Water Vapor transmission(透濕度) ≤ 0.03 g/m2.day ASTM E96
Heat-seal strength(封口強度) 11.3 kgf/15mm CNS 10591
Heat Sealing Conditions(熱封條件)    
Temperature(溫度) 108 ℃~220℃  
Time(時間) 0.5~3.5 seconds  
Pressure(壓力) 30~70 PSI  
Item CAS NO. Test Method Test
Results
Detected
Limit
Unit
Fluorine(F) 007782-41-4 Analysis was
performed by IC
N.D. 50 ppm(mg/kg)
Potassium(K+) 024203-36-9 Analysis was
performed by IC
N.D. 0.001 ug/cm2
Ammonium(NH4+) 014798-03-9 Analysis was
performed by IC
0.002 0.001 ug/cm2
Phosphate(Po43-) --- Analysis was
performed by IC
0.002 0.001 ug/cm2
Chromiun(Cr) 007440-47-3 Analysis was
performed by ICP-MS
N.D. 0.001 ug/cm2

可針對各種產品需求,設計不同的貼合材料,但需有最低訂購量,若需最新測試資料請洽業務人員,提供最新及符合您需求的庫存材料及規格品。

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